How Can Print Process Be Improved After NanoClear ® SMT Stencil Nano-Coating?

We often get asked how it is possible to further improve on your print process after implementation of NanoClear ® SMT stencil nano-coating on your stencils? In this technical bulletin we will cover suggested improvements to further improve upon your print process.


Technical Bulletin Series

Optimize Your Process After Nano-Coating by Optimizing Your Under-Stencil Wipe Solvent!!

The photos below show a popular lead-free solder paste with a stencil coated with NanoClear. The flux was tinted with a UV tracer to improve it's visibility. The performance improvement utilizing both an engineered solvent and NanoClear is clear!

Dry Wipe

Dry Wipe

  • Clear Apertures
  • Trace Smears of Flux on Stencil Surface
IPA Wipe

IPA Wipe

  • Clogged Apertures
  • Smears of Flux on Stencil Surface
Engineered Solvent Wipe

Engineered Solvent Wipe

  • Clear Apertures
  • No Flux on Stencil Surface

How to Check Solder Paste Compatibility

Often times, aperture blockages are caused by incompatiblity with under wipe solvents. Solvents containing IPA or other alcohols can react with the solder paste and cause it to congeal. Lead-free solder paste fluxes in particular use complex chemistries that may not be fully soluble in IPA.

  • Extrude solder paste into glass beaker or sample jar containing the solvent
  • Inspect for solubility or coagulation

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Ready to try NanoClear®?

Interested in seeing how NanoClear® can improve your process? Get in touch with any questions and to arrange for your free test samples.

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