Epoxy and Underfill Barrier
Our Epoxy and Underfill control coatings repel underfill, epoxy, mold compound, and other adhesives with an easy to apply repellent barrier. Eliminate failures due to resin bleedout without use of complicated physical barriers. Epoxy and underfill control are liquid phase treatments which can be easily applied via numerous selective dispense options. Together we create winning electronics packaging products!
Epoxy Control. Underfill Barrier. Failures Eliminated.
Aculon® has a variety of surface coating technologies capable of functionalizing precision electronics to be repellent in tightly controlled patterns. These ultra thin treatments effectively stop bleed out and spread of resin, epoxy, underfill and other materials which can cause failures in critical electronics packaging applications. There are numerous performance advantages to utilizing an epoxy and underfill control barrier in your chip package or PCB application.
Want to learn more? Reach out to us at +1-858-350-9499 or contact us here to see how we can help!
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Why underfill and epoxy barriers from Aculon for your application?
We are surface modification experts who have developed and produced surface chemistry technologies to modify a broad variety of surfaces, such as metal, glass, and polymers for nearly 20 years. We have implemented these technologies in a wide variety of electronics applications.
These treatments are all thin, easy to apply, safe, and non-toxic, with green options available. We have worked on countless applications, invested hundreds of thousand of hours solving surface related challenges. You are very likely reading this as you too have a challenge that can be solved by modifying your surface to have improved surface qualities. We will work directly with you on a customized solution tailored to the unique needs of your product. Let us help you make your product better.
Want to learn more? Reach out to us at +1-858-350-9499 or contact us here to see how we can help!
