Improve Copper Adhesion. Reduce Delamination. Simplify Your Process.
Aculon® has a variety of surface modification technologies capable of functionalizing copper to improve adhesive behavior. Aculon’s® adhesion promoting coatings and treatments significantly alter the behavior of your copper surface to improve the surface bonding characteristics to a variety of functional adhesives and coatings. In addition these coatings are ultra thin (nanoscale) coatings which add no thickness of significance helping to minimize package size, critical to many electronics and other applications. There are numerous performance advantages to utilizing Aculon's adhesion promotion technology on countless applications.
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Real World Applications
Countless electronics applications benefit from having copper surfaces functionalized to have improved adhesion. A broad range of technologies at our disposal means we can tackle most any electronics adhesion challenge.
Numerous oil & gas applications benefit from adhesion promoting functional treatments for copper.
There are countless applications in numerous industries that can benefit from copper surfaces which have been functionalized to have improved adhesive characteristics. Chances are if you have a copper application which can benefit from improved adhesion and bonding, we have looked at it before and can help.
Aculon® surface modification technologies for copper can be utilized for numerous medical applications, enabling unique performance, process simplification and excellent value across a broad range of medical surfaces and applications.