Semiconductor Adhesion Promotion Treatments
Adhesion Promoter for Semiconductor Substrates
Aculon's semiconductor adhesion promotion technology capitalizes on both the unique bonding potential to a variety of semiconductors ubstrates and the versatility to modify the "other end" of SAMPs to deliver superior bonding to subsequently deposited coatings on metal. Aculon researchers have demonstrated adhesion promotion between various metals, such as paint to semiconductor or adhesive to semiconductor using chemically reactive SAMs.
Semiconductor Adhesion Promotion Coating
The use of Aculon's semiconductor adhesion promotors can eliminate the need for more costly pre-treatment or surface roughening that is often needed to promote adhesion of various substances to semiconductorsurfaces
The Aculon Advantage
- Nanoscale: 2-4 nm Thick Treatments
- No or Minimal Capital Equipment
- Easy to Apply
- Easy Scale Up
- Flexible Application Methods
- Treat Sensitive Parts
- Consumer Applied Technologies
- OEM Applied Technologies
- Durable Treatments
- Functionalize Nanoparticles
- Treat Metals and Metal Oxides
- Treat Siloxane Hardcoats
- Treat Glass Oxides
- Increase Adhesion
Adhesion Promotion Markets
Compatible Semiconductor Substrates
Aculon's adhesion promotion treatments for semiconductor include:
- Silicon Adhesion Promoter
- Gallium Arsenide Adhesion Promoter
- Cadmium Sulfide Adhesion Promoter
- Germanium Adhesion Promoter
- Organic Semiconductor Adhesion Promoter
- And Many More!